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 MOTOROLA
Order this document by Rev: 4.91 Date: 10th July, 2002
SEMICONDUCTOR
TECHNICAL DATA
XC33989
SYSTEM BASIS CHIP WITH HIGH SPEED CAN
SEMICONDUCTOR TECHNICAL DATA
Advance Information
System Basis Chip with High Speed CAN Transceiver
The MC33989 is a monolithic integrated circuit combining many functions frequently used by automotive ECUs. It incorporates: - Two voltage regulators. - Four high voltage inputs. - 1Mbaud CAN physical interface. * Vdd1: Low drop voltage regulator, current limitation, over temperature detection, monitoring and reset function * Vdd1: Total current capability 200mA. * V2: Tracking function of Vdd1 regulator. Control circuitry for external bipolar ballast transistor for high flexibility in choice of peripheral voltage and current supply. * Four operational modes (normal, stand-by, stop and sleep mode) * Low stand-by current consumption in stop and sleep modes * High speed 1MBaud CAN physical interface. * Four external high voltage wake-up inputs, associated with HS1 Vbat switch * 150mA output current capability for HS1 Vbat switch allowing drive of external switches pull up resistors or relays * Vsup failure detection * Nominal DC operating voltage from 5.5 to 27V, extended range down to 4.5V. * 40V maximum transient voltage * Programmable software time out and window watchdog * Safe mode with separate outputs for Watchdog time out and Reset * Wake up capabilities (four wake up inputs, programmable cyclic sense, forced wake up, CAN interface, SPI and stop mode over current) * Interface with MCU through SPI
DW SUFFIX PLASTIC PACKAGE CASE 751-F (SO-28)
PIN CONNECTIONS
RX TX Vdd1 Reset INTB GND GND GND GND V2 V2ctrl Vsup HS1 L0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15
Simplified Block Diagram
Q1 Vbat V2CTRL Vsup V2
WDOGB CSB MOSI MISO SCLK GND GND GND GND CANL CANH L3 L2 L1
Vsup monitor Dual Voltage Regulator Vdd1 Monitor
HS1 control
5V/200mA
CAN supply Vdd1
Mode control Oscillator Interrupt Watchdog Reset
INTB WDOGB
HS1
L0 L1 L2 L3
Programmable wake-up input
Reset
MOSI SCLK MISO CSB V2 TX RX Gnd
Device
SPI
CAN H Rterm CAN L
High Speed 1Mbit/s CAN Physical Interface
ORDERING INFORMATION
Operating Temperature Range Package
PC33989DW
TA = -40 to 125C
SO-28
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Motorola,Inc 2002
MC33989
1
MAXIMUM RATINGS
Ratings Symbol Min Typ Max Unit
ELECTRICAL RATINGS
Supply Voltage at Vsup - Continuous voltage - Transient voltage (Load dump) Logic Inputs (Rx, Tx, MOSI, MISO, CSB, SCLK, Reset, WDOGB, INTB) Output current Vdd1 HS1 - voltage - output current ESD voltage (HBM 100pF, 1.5k) - HS1, L0, L1, L2, L3 - All other pins ESD voltage (Machine Model) All pins except CANH and CANL L0, L1,L2, L3 - DC Input voltage - DC Input current - Transient input voltage (according to ISO7637 specification) and with external component (see figure 1 below).
THERMAL RATINGS
V Vsup Vsup Vlog I V I Vesdh -4 -2 Vesdm Vwu DC -0.3 -2 -100 40 2 +100 V mA V -200 4 2 200 V -0.3 Internally limited -0.3 - 0.3 Internally limited Vsup+0.3 27 40 Vdd1+0.3 V A V A kV
Junction Temperature Storage Temperature Ambient Temperature (for info only) Thermal resistance junction to gnd pins (note 1) note 1: gnd pins 6, 7, 8, 9, 20, 21, 22, 23
Tj Ts Ta Rthj/p
- 40 - 55 - 40
+150 +165 +125 20
C C C C/W
Figure 1. : Transient test pulse for L0, L1, L2 and L3 inputs
1nF Lx 10 k Gnd
Transient Pulse Generator (note) Gnd
note: Waveform in accordance to ISO7637 part1, test pulses 1, 2, 3a and 3b.
MC33989
2
MC33989
2
ELECTRICAL CHARACTERISTICS
(Vsup From 5.5V to 18V and Tamb -40C to 125C) For all pins except CANH, CANL, Tx and Rx which are described in the CAN module section
Characteristics Description Vsup pin (Device power supply) Nominal DC Voltage range Extended DC Voltage range 1 Extended DC Voltage range 2 Input Voltage during Load Dump Input Voltage during jump start Supply Current in Stand-by Mode (note 2,4) (includes 10mA at Vdd1) Supply Current in Normal Mode (note 2)
Vsup
Symbol Min Typ Max
Unit
Conditions
5.5 4.5 18
18 5.5 27 40 27 12 17
V V V V V mA Reduced functionality (note 1) (note 3) Load dump situation Jump start situation Iout at Vdd1 =10mA CAN recessive or sleepdisable state Iout at Vdd1 =10mA CAN recessive or sleepdisable state Vdd1 & V2 off, Vsup<12V, oscillator running (note5) CAN in sleep-disable state Vdd1 & V2 off, Vsup<12V oscillator not running (5) CAN in sleep-disable state Vdd1 & V2 off, Vsup>12V oscillator running (5) CAN in sleep-disable state Vdd1 on, Vsup<12V oscillator running (5) CAN in sleep-disable state Vdd1 on, Vsup<12V oscillator not running (5) CAN in sleep-disable state Vdd on, Vsup>12 oscillator running (5) CAN in sleep-disable state guaranteed by design In normal & standby mode In normal & standby mode guaranteed by design
Vsup-ex1 Vsup-ex2
VsupLD VsupJS Isup(stdby)
Isup(norm)
12.5
17
mA
Supply Current in Sleep Mode (note 2,4)
Isup (sleep1)
72
105
uA
Supply Current in Sleep Mode (note 2,4)
Isup (sleep2)
57
90
uA
Supply current in sleep mode (note 2,4)
Isup (sleep3)
100
150
uA
Supply Current in Stop mode (note 2,4) I out Vdd1 <2mA Supply Current in Stop mode (note 2,4) I out Vdd1 <2mA Supply Current in Stop mode (note 2,4) Iout Vdd1 < 2mA BATFAIL Flag internal threshold BATFAIL Flag hysteresis Battery fall early warning threshold Battery fall early warning hysteresis
Isup (stop1) Isup (stop2) Isup (stop3) VBF VBF hyst BFew BFewh 5.3 0.1 1.5
135
210
uA
130
410
uA
160
230
uA
3 1 5.8 0.2
4 6.3 0.3
V V V V
note 1: Vdd1>4V, reset high, logic pin high level reduced, device is functional. note 2: Current measured at Vsup pin. note 3: Device is fully functional. All functions are operating (All mode available and operating, Watchdog, HS1 turn ON turn OFF, CAN cell operating, L0 to L3 inputs operating, SPI read write operation). Over temperature may occur. note 4: With CAN cell in sleep-disable state. If CAN cell is sleep-enabled for wake up, an additional 60uA must be added to specified value. note 5: Oscillator running means "Forced Wake up" or "Cyclic Sense" or "Software Watchdog in stop mode" timer activated. Oscillator not running means that "Forced Wake up" and "cyclic Sense" and "Software Watchdog in stop mode" are not activated.
Vdd1 (external 5V output for MCU supply). Idd1 is the total regulator output current. Vdd specification with external capacitor. Stability requirement: C>47uF ESR < 1.3 ohms (tantalum capacitor) In reset, normal request, normal and standby modes. Measures with C=47uF Tantalum. Vdd1 Output Voltage Vdd1out 4.9 5 5.1 V Idd1 from 2 to 200mA Tamb -40C to 125C 5.5V< Vsup <27V Idd1 from 2 to 200mA 4.5V< Vsup <5.5V
Vdd1 Output Voltage
Vdd1out
4
V
MC33989
3
MC33989
(Vsup From 5.5V to 18V and Tamb -40C to 125C) For all pins except CANH, CANL, Tx and Rx which are described in the CAN module section
Characteristics Description Dropout Voltage Dropout Voltage, limited output current Idd1 output current Thermal Shutdown (junction) Over temperature pre warning (junction) Temperature Threshold difference Reset threshold 1 Reset threshold 2 Vdd1 range for Reset Active Reset Delay Time Line Regulation (C at Vdd1= 47uF tantal) Line Regulation (C at Vdd1= 47uF tantal) Load Regulation (C at Vdd1= 47uF tantal) Thermal stability Vdd1 in Stop mode Vdd1 Output Voltage Vdd1 Output Voltage Idd1 stop output current to wake up SBC Idd1 over current wake up deglitcher time Reset threshold Reset threshold Line regulation (C at Vdd1= 47uF tantal) Load regulation (C at Vdd1= 47uF tantal) Vddstop Vddstop2 Idd1s-wu Idd1 - dglt Rst-stop1 Rst-stop2 LR-s LD-s 4.75 4.75 10 40 4.5 4.1 5,00 5,00 17 55 4.6 4.2 5 15 5.25 5.25 25 75 4.7 4.3 25 75 V V mA us V V mV mV 5.5VC C C
Unit
Conditions Idd1 = 200mA Idd1 = 50mA 4.5V< Vsup Internally limited Normal or standby mode VDDTEMP bit set Selectable by SPI. Default value after reset. Selectable by SPI Measured at 50% of reset signal 9VV V V us mV mV mV mV
V2 tracking voltage regulator note 3: V2 specification with external capacitor - Stability requirement: C>42uF and ESR<1.3 ohm (tantalum capacitor), external resistor between base and emitter required. - Measurement conditions: Ballast transistor MJD32C, C=10uF tantalum, 2.2k resistor between base and emitter of ballast transistor. V2 Output Voltage (C at V2 = 10uF tantal) I2 output current (for information only) V2 ctrl drive current capability V2LOW Flag Threshold Low Level Output Voltage High Level Output Voltage Tristated MISO Leakage Current Logic input pins (MOSI, SCLK, CSB) High Level Input Voltage Low Level Input Voltage High Level Input Current on CSB Low Level Input Current CSB MOSI, SCK Input Current Vih Vil Iih Iil Iin 0.7Vdd1 -0.3 -100 -100 -10 Vdd1+0.3 0.3Vdd1 -20 -20 10 V uA uA uA Vi=4V Vi=1V 0Logic output pins (MISO) Push pull structure with tri state condition (CSB high).
MC33989
4
MC33989
(Vsup From 5.5V to 18V and Tamb -40C to 125C) For all pins except CANH, CANL, Tx and Rx which are described in the CAN module section
Characteristics Description Symbol Min Typ Max Unit Conditions
Reset Pin (output pin only, supply from Vdd1. Structure switch to gnd with pull up current source) High Level Output current Low Level Output Voltage (I0=1.5mA) Low Level Output Voltage (I0=tbd mA) Reset pull down current Reset Duration after Vdd1 High Wdogb output pin (Push pull structure) Low Level Output Voltage (I0=1.5mA) High Level Output Voltage (I0=-250uA) INT Pin( Push pull structure) Low Level Output Voltage (I0=1.5mA) High Level Output Voltage (I0=-250uA) HS1: 150mA High side output pin Rdson at Tj=25C, and Iout -150mA Rdson at Ta=125C, and Iout -150mA Rdson at Ta=125C, and Iout -120mA Output current limitation Over temperature Shutdown Leakage current Output Clamp Voltage at Iout= -10mA L0, L1, L2, L3 inputs Negative Switching Threshold Vthn 2 2.5 2.7 2.7 3 3.5 0.6 -10 8 0.25 250 125 125 100 100 40 40 25 25 20 2.5 3 3.2 3.3 4 4.2 3 3.6 3.7 3.8 4.6 4.7 1.3 10 38 4 N/A N/A N/A N/A N/A N/A N/A 50 50 50 50 50 V 5.5VC
Ioh Vol Vol Ipdw reset-dur Vol Voh Vol Voh
-300 0 0 2.3 3 0 Vdd1-0.9 0 Vdd1-0.9
-250
-150 0.9 0.9 5
uA V V mA ms V
00.9V
3.4
4 0.9 Vdd1 0.9 Vdd1
1vV
Vsup>9V Vsup>9V 5.5uA V no inductive load drive capability
Positive Switching Threshold
Vthp
V
Hysteresis Input current Wake up Filter Time DIGITAL INTERFACE TIMING SPI operation frequency SCLK Clock Period SCLK Clock High Time SCLK Clock Low Time Falling Edge of CS to Rising Edge of SCLK Falling Edge of SCLK to Rising Edge of CS MOSI to Falling Edge of SCLK Falling Edge of SCLK to MOSI MISO Rise Time (CL = 220pF) MISO Fall Time (CL = 220pF) Time from Falling or Rising Edges of CS to: - MISO Low Impedance - MISO High Impedance Time from Rising Edge of SCLK to MISO Data Valid
Vhyst Iin Twuf Freq tpCLK twSCLKH twSCLKL tlead tlag tSISU tSIH trSO tfSO tSOEN tSODIS tvalid
V uA us MHz ns ns ns ns ns ns ns ns ns ns
ns
0.2 V1==0.8V1, CL=200pF
MC33989
5
MC33989
(Vsup From 5.5V to 18V and Tamb -40C to 125C) For all pins except CANH, CANL, Tx and Rx which are described in the CAN module section
Characteristics Description Symbol Min Typ Max Unit Conditions
STATE MACHINE TIMING note 1: delay starts at falling edge of clock cycle #8 of the SPI command and start of "Turn on" or "Turn off" of HS1 or V2. Delay between CSB low to high transistion (at end of SPI stop command) and Stop mode activation Interrupt low level duration Internal oscillator frequency Tcsb-stop Tint Osc-f1 18 7 10 100 34 13 us us kHz Guaranteed by design detected by V2 off SBC in stop mode All modes except Sleep and Stop, guaranted by design Sleep and Stop modes, guaranted by design Normal and standby modes Normal and standby modes Normal and standby modes Normal and standby modes Normal and standby modes Normal request mode Stop mode Stop mode Stop mode Stop mode Stop mode Sleep and stop modes Sleep and stop modes Sleep and stop modes Sleep and stop modes Sleep and stop modes Sleep and stop modes Sleep and stop modes Sleep and stop modes in sleep and stop modes threshold and condition to be added in sleep and stop mode Normal or standby mode Vsup>9V Normal or standby mode Vsup>9V Standby mode Normal modes Normal request mode SBC Normal mode guaranteed by design SBC Normal mode guaranteed by design
Internal low power oscillator frequency Watchdog period 1 Watchdog period 2 Watchdog period 3 Watchdog period 4 Watchdog period accuracy Normal request mode timeout Watchdog period 1 - stop Watchdog period 2- stop Watchdog period 3 - stop Watchdog period 4 - stop Stop mode watchdog period accuracy Cyclic sense/FWU timing 1 Cyclic sense/FWU timing 2 Cyclic sense/FWU timing 3 Cyclic sense/FWU timing 4 Cyclic sense/FWU timing 5 Cyclic sense/FWU timing 6 Cyclic sense/FWU timing 7 Cyclic sense/FWU timing 8 Cyclic sense On time
Osc-f2 Wd1 Wd2 Wd3 Wd4 F1acc NRtout Wd1stop Wd2stop Wd3stop Wd4stop F2acc CSFWU1 CSFWU2 CSFWU3 CSFWU4 CSFWU5 CSFWU6 CSFWU7 CSFWU8 Ton 8.58 39.6 88 308 -12 308 6.82 31.5 70 245 -30 3.22 6.47 12.9 25.9 51.8 66.8 134 271 200
100 9.75 45 100 350 350 9.75 45 100 350 4.6 9.25 18.5 37 74 95.5 191 388 350 10.92 50.4 112 392 12 392 12.7 58.5 130 455 30 5.98 12 24 48.1 96.2 124 248 504 500
kHz ms ms ms ms % ms ms ms ms ms % ms ms ms ms ms ms ms ms us
Cyclic sense/FWU timing accuracy Delay between SPI command and HS1 turn on (note 1) Delay between SPI command and HS1 turn off (note 1) Delay between SPI and V2 turn on (note 1) Delay between SPI and V2 turn off (note 1) Delay between Normal Request and Normal mode, after W/D trigger command Delay between SPI and "CAN normal mode" Delay between SPI and "CAN sleep mode"
Tacc Ts-HSon Ts-HSoff Ts-V2on Ts-V2off Ts-NR2N Ts-CANn Ts-CANs
-30
+30 22 22
% us us us us us us us
9 9 15 35
22 22 70 10 10
MC33989
6
MC33989
(Vsup From 5.5V to 18V and Tamb -40C to 125C) For all pins except CANH, CANL, Tx and Rx which are described in the CAN module section
Characteristics Description Delay between CSB wake up (CSB low to high) and SBC normal request mode (Vdd1 on & reset high) Delay between CSB wake up (CSB low to high) and first accepted SPI command Delay between INT pulse and 1st SPi command accepted Symbol Min Tw-csb 15 Typ 40 Max 90 us SBC in stop mode Unit Conditions
Tw-spi Ts-1stspi
90 20
N/A N/A
us us
SBC in stop mode In stop mode after wake up
Figure 2. SPI Timing characteristic
Tpclk
CSB
Tlead Twclkh Tlag
SCLK
Twclkl Tsisu Tsih
MOSI
Undefined
Tvalid
Di 0
Don't Care
Di 8
Don't Care
Tsodis
Tsoen
MISO
Do 0
Do 8
Note: Incomming data at MOSI pin is sampled by the SBC at SCLK falling edge. Outcoming data at MISO pin is set by the SBC at SCLK rising edge (after Tvalid delay time).
MC33989
7
MC33989
3
CAN MODULE SPECIFICATION
MAXIMUM RATING Ratings
ELECTRICAL RATINGS
Symbol
Min
Typ
Max
Unit
CANL,CANH Continuous voltage CANL,CANH Continuous current CANH, CANL Transient voltage (Load dump, note1) CANH, CANL Transient voltage (note2) Logic Inputs (Tx, Rx) ESD voltage (HBM 100pF, 1.5k), CANL, CANH ESD voltage (Machine Model) CANH, CAN L
VcanH,L IcanH,L VtrH,L VtrH,L U Vesd-ch Vesd-cm
-27
40 200 40
V mA V V V kV V
-40 - 0.5 -4 -200
40 6 4 200
ELECTRICAL CHARACTERISTICS VDD1 = 4,75 to 5,25; Vsup=5.5 to 27V; Tamb = -40 to 125C unless otherwise specified Descriptions
Supply Supply current of CAN cell Supply current of CAN cell
Ires Idom
Symbol
Min
Typ
Max
Unit
Conditions
1.5 2
3 6
mA mA
Recessive state Dominant state, without bus load V2 regulator off
Supply current of CAN cell CAN in sleep state wake up enable Supply current of CAN cell CAN in sleep state wake up disabled CANH and CANL Bus pins common mode voltage Differential input voltage
Isleep
55
70
uA
Idis
1
uA
V2 regulator off (guaranteed by design)
-27
VcanhVcanl
40 500
V mV Common mode between -3 and +7V. Recessive state at Rx Common mode between -3 and +7V. Dominant state at Rx
Differential input voltage
900
mV
Differential input hysteresis (Rx) Input resistance Differential input resistance Unpowered node input current CANH output voltage CANL output voltage Differential output voltage CANH output voltage CANL output voltage Differential output voltage
8
100
Rin Rind
mV 100 100 1.5 Kohms Kohms mA V V V V V 100 mV TX dominant state Tx dominant state Tx dominant state Tx recessive state Tx recessive state Tx recessive state
5 10
2.75 0.5 1.5
4.5 2.25 3 3
2
MC33989
MC33989
DEVICE DESCRIPTION
Descriptions
CAN H output current capability CAN L output current capability Over temperature shutdown CAN L over current detection
Symbol
Icanh Icanl Tshut Icanl-oc
Min
Typ
Max
-35
Unit
mA mA
Conditions
Dominant state Dominant state
35 160 60 180C 200
C
mA
Error reported in CANR register Error reported in CANR register
CAN H over current detection
Icanh-oc
-200
-60
mA
TX and RX Tx Input High Voltage Tx Input Low Voltage Tx High Level Input Current, Vtx=Vdd Tx Low Level Input Current, Vtx=0V Rx Output Voltage High, Irx=-250uA Rx Output Voltage Low, Irx=+1mA Timing Dominant State Timeout Propagation loop delay Tx to Rx, Recessif to dominant Tdout Tlrd 200 70 80 100 110 20 40 60 100 30 360 140 155 180 220 65 80 120 160 80 520 210 225 255 310 110 150 200 300 140 us ns slew rate 3 slew rate 2 slew rate 1 slew rate 0 slew rate 3 slew rate 2 slew rate 1 slew rate 0 Vih Vilp Iih Iil Voh Vol 0.7 Vdd -0.4 -10 -100 Vdd-1 0.5 -50 Vdd+0.4 0.3 Vdd 10 -20 V V uA uA V V
Ttrd Propagation delay Tx to CAN
ns
Propagation delay CAN to Rx, recessif to dominant Propagation loop delay Tx to Rx, Dominat to recessif
Trrd
ns
Tldr
70 90 100 130 60 65 75 90 20
120 135 160 200 110 120 150 190 40
170 180 220 260 130 150 200 300 60
ns
slew rate 3 slew rate 2 slew rate 1 slew rate 0 slew rate 3 slew rate 2 slew rate 1 slew rate 0
Ttdr Propagation delay Tx to CAN
ns
Propagation delay CAN to Rx, dominant to recessif
Trdr
ns
Non differential slew rate (CanL or CanH)
Tsl 3 Tsl 2 Tsl 1 Tsl 0
4 3 2 1
19 13.5 8 5
40 20 15 10
V/us
slew rate 3 slew rate 2 slew rate 1 slew rate 0
note 1: Load dump test according to ISO7637 part 1 note 2: Transient test according to ISO7637 part 1, pulses 1,2,3a and 3b, according to schematic figure below. note 3: Human Body Model; C=100pF, R=1.5Kohms note 4: Machine Model; C=200pF, R=25ohms
MC33989
9
MC33989
DEVICE DESCRIPTION
Figure 3. Transient test pulses for CANH and CANL 1nF CAN H CAN L Gnd 1nF Transient Pulse Generator (note) Gnd
note: Waveform in accordance to ISO7637 part1, test pulses 1, 2, 3a and 3b. Figure 4. Transceiver AC characteristics
3.1
CAN error detection and wake up The error and the wake up are reported in the CANR register.
3.1.1 Dominant State Time-out This protection is based on the fact that all CAN signals can not have more than five bits in a row with the same state. In case of a condition the Tx pin is stuck at 0v, the transceiver would hold the bus in dominant state making it impossible to the others CAN modules to use the bus. The protection acts releasing the bus when a dominant signal with more than 350uS typical (Tdout time) is present in the Tx signal. After entering the fault condition the driver is disabled. To clear this disabled state the CAN transceiver needs to have its input going to recessive state. 3.1.2 Internal Error output flags There are internal error flags to signals when one of the below condition happens. The errors are reported in CAN register. * Thermal protection activated (bit THERM) * Over Current detection in CANL or CANH pins (bit CUR). * Time-out condition for dominant state (bit TXF). 3.1.3 Sleep mode & Wake-up via CAN bus feature The HSCAN interface enters in a low consumption mode when the "CAN sleep mode" is enabled. In this mode the HSCAN module will have a 60uA consumption via internal 5V. When in sleep mode the transmitter and the receiver are disabled, the only part of circuit which remains working is the wake up module which contains a special low power receiver to check the bus lines and according to its activity generate a wake up output signal. The conditions for the wake is meet when there are 3 valid pulses in a row. A valid signal must have a pulse width bigger than 0.5us and no more than 0.5ms.
MC33989
10
MC33989
diagram to be inserted
Figure 5. Wake up block diagram The block diagram illustrates how the wake up signal is generated. First the CAN signal is detected by a low consumption receiver (WU receiver). Then the signal passes through a pulse width filter which discards the undesired pulses. The pulse must have a width bigger than 0.5us and smaller than 500us to be acepted. When a pulse is discarded the pulse counter is reseted and no wake signal is generated, otherwise when a pulse is acepted the pulse counter is incremented and after three pulses the wake signal is asserted. Each one of the pulses must be spaced by no more than 500us. In that case the pulse counter is reset and no wake signal is generated. This is accomplished by the wake time-out generator. The wake up cycle is completed (and the wake flag reset) when the CAN interface is brought to "CAN normal" mode. The wake up capability of the CAN can be disabled, refer to SPI interface and register section, CAN register.
MC33989
11
MC33989
4
GENERAL DESCRIPTION
The MC33989 is an integrated circuit dedicated to automotive applications. It includes the following functions: - One full protected voltage regulator with 200mA total output current capability available at Vdd1 external pin. - Driver for external path transistor for V2 regulator function. - Reset, programmable watchdog function, INT, 4 operational modes - Programmable wake up input and cyclic sense wake up - Can high speed physical interface
Device Supply The device is supplied from the battery line through the Vsup pin. An external diode is required to protect against negative transients and reverse battery. It can operate from 4.5V and under the jump start condition at 27V DC. This pin sustains standard automotive voltage conditions such as load dump at 40V. When Vsup falls below 3V typical the MC33989 detects it and store the information into the SPI register, in a bit called "BATFAIL". This detection is available in all operation modes. The device incorporates a battery early warning function, which provides a maskable interrupt when the Vsup voltage is below 6V typical. An hysteresis is included. Operation is only in Normal and Standby modes. Vsup low is reported in IOR register. 4.2 Vdd1 Voltage Regulator Vdd1 Regulator is a 5V output voltage with output current capability up to 200mA. It includes a voltage monitoring circuitry associated with a reset function. The Vdd1 regulator is fully protected against over current, short-circuit and has over temperature detection warning flags (bit VDDTEMP in MCR and INTR registers) and over temperature shutdown with hysteresis. V2 regulator V2 Regulator circuitry is designed to drive an external path transistor in order to increase output current flexibility. Two pins are used: V2 and V2 ctrl. Output voltage is 5V and is realized by a tracking function of the Vdd1 regulator. Recommended ballast transistor is MJD32C. Other transistor can be used, however depending upon the PNP gain an external resistor-capacitor network might be connected. V2 is the supply input for the CAN cell. The state of V2 is reported in the IOR register (bit V2LOW set to 1 if V2 is below 4.5V typical). HS1 Vbat Switch Output HS1 output is a 2 ohms typical switch from Vsup pin. It allows the supply of external switches and their associated pull up or pull down circuitry, in conjunction with the wake up input pins for example. Output current is limited to 200mA and HS1 is protected against short-circuit and has an over temperature shutdown (bit HS1OT in IOR and bit HS1OT-V2LOW in INTR register). HS1 output is controlled from the internal register and SPI. It can be activated at regular intervals in sleep and stop modes thanks to internal timer. It can also be permanently turned on in normal or stand-by modes to drive loads or supply peripheral components. No internal clamping protection circuit is implemented, thus dedicated external protection circuit is required in case of inductive load drive. 4.5 4.6 Battery fall early warning: Refer to paragraph 4.1. 4.4 4.3
4.1
Internal Clock The device has an internal clock used to generate all timings (reset, watchdog, cyclic wake up, filtering time etc....). Two oscillators are implemented. A high accuracy (+-12%) used in Normal request, normal and standby modes and a low accuracy (+30%)used in sleep and stop modes. Functional Modes The device has four modes of operation, the stand-by mode, normal mode, stop and sleep modes. All modes are controlled by the SPI. An additional temporary mode called "normal request mode" is automatically accessed by the device after reset or wake up from stop mode. A reset mode is also implemented. Special modes and configuration are possible for debug and program MCU flash memory. 4.7.1 Reset mode: In this mode, reset pin is low, an a timer is running for a time "reset-dur". After this time is ellapsed, the SBC enters Normal Request mode. Reset mode is enter if a reset condition occurs (Vdd1 low, watchdog timeout or watchdog trigger in closed window). 4.7.2 Normal request mode: 4.7
4.7.2.1 Description: This is a temporary mode automatically accessed by the device after reset mode or after the SBC wake up from stop mode. After wake up from sleep mode or after device power up the SBC enters the reset mode first and then enters the Normal request mode. After a wake up from stop mode, the SBC enters Normal Request mode directly. In Normal Request mode the Vdd1 regulator is ON, V2 is off, the reset pin is high. As soon as the device enters the normal request mode an internal 350ms timer is started. During these 350ms the micro controller of the application must addressed the SBC via SPI and configure the watchdog register. This is the condition for the SBC to stop the 350ms timer and to go into the Normal mode or standby mode and to set the watchdog timer according to configuration.
12
MC33989
MC33989
4.7.2.2 Normal request entered and no W/D configuration occurs: In case the Normal request mode is entered after SBC power up or after a wake up from stop mode, and if no W/D configuration occurs while the SBC is in Normal request mode, the SBC goes to reset mode after the 350ms time period is expired, and then goes again into Normal request mode. If no W/D configuration is done, the SBC alternatively goes from normal request into reset then normal request modes etc. In case the Normal request mode is entered after a wake up from sleep mode and if no W/D configuration occurs while the SBC is in Normal request mode, the SBC goes back to sleep mode. 4.7.3 Normal mode: In this mode both regulators are ON and this corresponds to the normal application operation. All functions are available in this mode (watchdog, wake up input reading through SPI, HS1 activation, CAN communication). The software watchdog is running and must be periodically cleared through SPI. 4.7.4 Standby mode: Only the regulator 1 is ON. Regulator 2 is turned OFF by disabling the V2 ctrl pin. Only the wake-up capability of the CAN interface is available. Other functions available are: wake up input reading through SPI, HS1 activation. The watchdog is running. 4.7.5 Sleep mode: Regulators 1 and 2 are OFF. The current from Vsup pin is reduced. In this mode, the device can be awakened internally by cyclic sense via the wake up inputs pins and HS1 output, from the "forced wake up" function and from the CAN physical interface. When a wake up occurs the SBC goes first into reset mode, then enters Normal request mode. 4.7.6 Stop mode
4.7.6.1 Description Regulator 2 is turned OFF by disabling the V2 ctrl pin. The regulator 1 is activated in a special low power mode which allow to deliver few mA. The objective is to maintain the MCU of the application supplied while it is turned into power saving condition (i.e stop or wait mode). In stop mode the device supply current from Vbat is very low. When the application is in stop mode (both MCU and SBC), the application can wake up from the SBC side (ex cyclic sense, forced wake up, CAN message, wake up inputs and over current on Vdd1) or the MCU side (key wake up etc.). Stop mode is always selected by SPI. In stop mode the Software watchdog can be "running" or "not running" depending upon selection by SPI (RCR register, bit WDSTOP). If W/D runs, to clear the W/D the SBC must be wake up by a CSB pin (SPI wake up). In stop mode, SBC wake up capability are identical as in sleep mode. Refer to table 1. 4.7.6.2 Application wake up from SBC side: When application is in stop mode, it can wake up from the SBC side. When a wake up is detected by the SBC (ex CAN, Wake up input etc.) the SBC turns itself into Normal request mode and generates an interrupt pulse at the INTB pin. 4.7.6.3 Application wake up from MCU side: When application is in stop mode, the wake up event may come from the MCU side. In this case the MCU signals to the SBC by a low to high transition on the CSB pin. Then the SBC goes into Normal Request mode and generates an interrupt pulse at the INTB pin. 4.7.6.4 Stop mode current monitor: If the Vdd1 output current exceed an internal threshold (Idd1s-wu), the SBC goes automatically into normal request mode and generates an interrupt at the INTB pin. The interrupt is not maskable and the interrupt register will have no flag set. 4.7.6.5 INT generation when wake up from stop mode: When the SBC wakes up from stop mode, it first enters the normal request mode and then generates a pulse (10us typical) on the INTB pin. These interrupts are not maskable, and the wake up event can be read through the SPI registers (CANWU bit in RCR register and LCTRx bit in WUR register). In case of wake up from Stop mode over current or from forced wake up, no bit are set. After the INT pulse the SBC accept SPi command after a time delay (Ts-1stspi parameter). 4.7.6.6 Software watchdog in stop mode: If watchdog is enabled, the MCU has to wake up independently of the SBC before the end of the SBC watchdog time. In order to do this the MCU has to signals the wake up to the SBC through the SPI wake up (CSB activation). Then the SBC wakes up and jump into the normal request mode. MCU has to configured the SBC to go to either normal or standby mode. The MCU can then decide to go back again to stop mode. If no MCU wakes up occurs within the watchdog timing, the SBC will activate the reset pin and jump into the normal request mode. The MCU can then be initialized. 4.7.6.7 Stop mode enter command: Stop mode is entered at end of the SPI message at the rising edge fo the CSB . Refer to to "Tcsb-stop" data in state machine timing table.
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Once stop mode is entered the SBC could wake up from the V1 regulator over current detection. In order to allow time for the MCU to complete the last CPU instruction to allow MCU to enter its low power mode, a deglitcher time of typicall 40us is implemented. figure below indicate operation to enter stop mode. SPI Stop / Sleep command SPI CSB
Tcsb-stop
Idd1 - dglt
SBC in Normal or Standby mode
SBC in stop mode no Idd1 over I wake up
SBC in stop mode with Idd1over I wake up
4.8
Reset and watchdogb pins, sofwtare watchdog operations:
4.8.1 Software watchdog (selectable window or time out watchdog) Software watchdog is used in the SBC normal and stand-by modes for the MCU monitoring. The watchdog can be either window or time out. This is selectable by SPI (register TIM1, bit WDW). Default is window watchdog. The period for the watchdog is selectable from SPI from 10 to 350ms (register TIM1, bits WDT0 and WDT1). When the window watchdog is selected, the closed window is the first part of the selected period, and the open window is the second part of the period. Refer to SPI TIM register description. The watchdog can only be cleared within the open window time. An attempt to clear the watchdog in the closed window will generate a reset. Watchdog is cleared through SPI by addressing the TIM1 register. 4.8.2 Reset pin description A reset output is available in order to reset the microcontroller. Two operation modes for the reset pin are available, mode 1 and mode 2 (refer to table for reset pin operation). The reset cause when SBC is in mode 1 are: - Vdd1 falling out of range: if Vdd1 falls below the reset threshold (parameter Rst-th), the reset pin is pull low until Vdd1 return to nominal voltage. - Power on reset: at device power on or at device wake up from sleep mode, the reset is maintained low until Vdd1 is within its operation range. - Watchdog time out: if the watchdog is not cleared the SBC will pull the reset pin low for the duration of the reset duration time (parameter: reset-dur). In mode 2, the reset pin is not activated in case of watchdog time out. Refer to" table for reset pin operation"for mode detail. For debug purposes at 25C, reset pin can be shorted to 5V, thanks to its internal limited current drive capability. 4.8.3 Reset and Wdogb operation: mode1 and mode 2 (safe mode): The watchdog and reset functions have two modes of operation: mode 1 and mode 2 (mode 2 is also called safe mode). These modes are independent of the SBC modes (Normal, stand-by, sleep, stop). Mode 1 or mode 2 selection is done through SPI (register MCR, bit SAFE). Default mode after reset is mode 1. Table below is the reset and watchdog output mode of operation. Two modes (mode 1 and mode 2) are available and are selectable through the SPI, safe bit. Default operation after reset or power up is mode 1. In both modes reset is active at device power up and wake up. In mode 1: Reset is activated in case of Vdd1 fall or watchdog not triggered. Wdogb output is active low as soon as reset goes low and stays low as long as the watchdog is not properly re-activated by SPI. In mode 2, safe mode: Reset in not activated in case of Watchdog failure. WDOGB output has same behavior as in mode 1. The Wdogb output pin is a push pull structure than can drive external component of the application in order for instance to signal MCU wrong operation.
Events
Device power up - Vdd1 normal - Watchdog properly triggered
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Mode
1 or 2 (safe mode) 1
WDOGB output
low to high high
Reset output
low to high high
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Events
Vdd1 < Rst-th Watchdog time out reached - Vdd1 normal - Watchdog properly triggered Vdd1 < Rst-th Watchdog time out reached
Mode
1 1 2 (safe mode) 2 (safe mode) 2 (safe mode)
WDOGB output
high low (note1) high high low (note1)
Reset output
low low high low high
note1: Wdogb stays low until the Watchdog register is properly addressed through SPI. Figure 6. Reset and Wdogb functions diagram in mode 1 and 2
Watchdog time out
Vdd1 Reset MODE 1 WDOGB SPI W/D clear SPI CSB Watchdog register addressed Watchdog period
MODE 2
Reset WDOGB
4.9
Wake Up capabilities Several wake-up capabilities are available for the device when it is in sleep or stop mode. When a wake up has occurred, the wake up event is stored into the WUR or CAN registers. The MCU can then access to the wake up source. The wake up options are selectable trough SPI while the device is in normal or standby mode and prior to go to enter low power mode (sleep or stop mode). When a wake up occurs from sleep mode the device activates Vdd1. It generates an interrupt if wake up occurs from stop mode. 4.9.1 Wake up from wake up inputs (L0, L1, L2, L3) without cyclic sense The wake up lines are dedicated to sense external switches state and if changes occur to wake up the MCU (In sleep or stop modes). The wake up pins are able to handle 40V DC. The internal threshold is 3V typical and these inputs can be used as input port expander. The wake up inputs state can be read through SPI (register WUR). In order to select and activate direct wake up from the Lx inputs the WUR register must be configured with the appropriate level sensitivity, and the LPC register must be configured with 0xx0 data (bit LX2HS1 set at 0 and bit HS1AUTO set at 0). Level sensitivity is selected by WUR register. Level sensitivity are configured by pair of Lx inputs: L0 and L1 level sensitvity are configured toghether, L2 and L3 are configured toghether. 4.9.2 Cyclic sense wake up (Cyclic sense timer and wake up inputs L0, L1, L2, L3) The SBC can wake up upon state change of one of the four wake up input lines (L0, L1, L2 and L3) while the external pull up or pull down resistor of the switches associated to the wake up input lines are biased with HS1 Vsup switch. The HS1 switch is activated in sleep or stop mode from an internal timer. Cyclic sense and Forced wake up are exclusive. If Cyclic Sense is enabled the forced up can not be enabled. In order to select and activate the cyclic sense wake up from the Lx inputs the WUR register must be configured with the appropriate level sensitivity, and the LPC register must be configured with 1xx1 data (bit LX2HS1 set at 1 and bit HS1AUTO set at 1). The wake up mode selection (direct or cyclic sense) is valid for all 4 wake up inputs. 4.9.3 Forced wake up SBC can wake up automatically after a pre determined time spent in sleep or stop mode. Cyclic sense and Forced wake up are exclusive. If Forced wake up is enabled (FWU bit set to 1 in LPC register) the Cyclic Sense can not be enabled. 4.9.4 CAN interface wake up The device incorporates a high speed 1MBaud CAN physical interface. Its electrical parameters for the CANL, CANH, Rx
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and Tx pins are compatible to ISO11898 specification (IS0 11898: 1993(E)). The control of the CAN physical interface operation is done through the SPI. CAN modes are independent of the SBC operation modes. The device can wake up from a CAN message if CAN wake up has been enabled. Refer to CAN module description for detail of wake up detection. 4.9.5 SPI wake up The device can wake up by the CSB pin in sleep or stop mode. Wake up is detected by CSB pin transition from low to high level. In stop mode this correspond to the condition where MCU and SBC are in Stop mode and when the application wake up event comes through the MCU. 4.9.6 Device power up, SBC wake up After device or system power up, or after the SBC wakes up from sleep mode, it enters into "reset mode" then into "normal request mode". 4.10 Debug mode: hardware and software debug with the SBC. When the SBC is mounted on the same printed circuit board as the mico controller it supplies, both application software and SBC dedicated routine must be debugged. Following features allow the user to debug the software by allowing the possibility to disable the SBC internal software watchdog timer. 4.10.1 Device power up, reset pin connected to Vdd1 At SBC power up, the Vdd1 voltage is provided, but if no SPI communication occurs to configure the device, a reset occurs every 350ms. In order to allow software debug and avoid MCU reset the Reset pin can be connected directly to Vdd1 by a jumper. 4.10.2 Debug modes with software watchdog disabled though SPI (Normal Debug, Standby Debug and Stop Debug) The software watchdog can be disabled through SPI. In order to avoid unwanted watchdog disable and to limit the risk of disabling the watchdog during SBC normal operation the watchdog disable has to be done with the following sequence: Step 1) Power down the SBC Step 2) Power up the SBC (The BATFAIL bit is set, and the SBC enters normal request mode) Step 3) Write to TIM1 register to allow SBC to enter Normal mode Step 4) Write to MCR register with data 0000 (this enables the debug mode). (Complete SPI byte: 000 1 0000) Step 5) Write to MCR register normal debug (0001 x101) While in debug mode, the SBC can be used without having to clear the W/D on a regular basis to facilitate software and hardware debug. Step 6) To leave the debug mode, write 0000 to MCR register. At step 2, the SBC is in normal request. Step 3, 4 and 5 should be done consecutiveley and withing the 350ms time period of the normal requets mode. If not, the SBC will go into reset mode and enter again normal request. When the SBC is in debug mode, and has been set into stop debug or sleep debug, when a wake up occurs the SBC enters Normal requets mode, for a time period of 350ms. In order to avoid the SBC to generate a reset (enter reset mode) the desired next debug mode (normal debug or standby debug) should be configured within the 350ms time period of the normal requets mode (for detail refer to "State machine in debug mode"). To avoid entering debug mode after a power up, first read BATFAIL bit (MCR read) and write 0000 into MCR. The graph below illustrates the debug mode enter. VSup Vdd1 Batfail TIM1(step 3) SPI MCR(step4) debug mode SPI: read batfail SBC in debug Mode, no W/D SBC not in debug Mode and W/D on MCR (step5) MCR (step6)
4.10.3 MCU flash programming configuration In order to allow the possibility to download software into the application memory (MCU EEPROM or Flash) the SBC allows the following capabilities: The Vdd1 can be forced by an external power supply to 5V and the reset and Wdogb outputs by external signal sources to zero or 5V and this without damage. This allow for instance to supply the complete application board by external power supply and to apply the correct signal to reset pins.No function of the SBC are operating. Due to pass transistor from Vdd1 to Vsup, supplying the device from Vdd1 pin biases the Vsup pin. So Vsup should be left open of forced to value above 5V. Reset pin is periodically pulled low for "reset dur" time (3.4ms typical) and then pulled to Vdd1 for 350ms typical. During the time reset is low, reset pin sinks 5mA maximum (Ipdw parameter).
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Figure 7. Simplified schematic for Flash programming
Simplified connection used in Flash programming mode Vsup (open or >5V Vdd1
SBC
reset Wdogb
MCU = Flash
Programming bus
External supply and sources applied to Vdd1, reset and Wdogb test points on application circuit board.
4.11 Package and thermal consideration The device is proposed in a standard surface mount SO28 package. In order to improve the thermal performances of the SO28 package, 8 pins are internally connected to the lead frame and are used for heat transfer to the printed circuit board.
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5
TABLE OF OPERATION
The table below describes the SBC operation modes. "Normal Debug", "Standby Debug" and "Stop Debug" are entered via special sequence described at debug mode paragraph.
mode
Voltage Regulator HS1 switch Vdd1: ON V2: OFF HS1: OFF Vdd1: ON V2: ON HS1 controllable Vdd1: ON V2: OFF HS1 controllable Vdd1: ON (limited current capability) V2: OFF HS1: OFF or cyclic Vdd1: OFF V2: OFF HS1 OFF or cyclic Same as Normal Same as Standby
Wake up capabilities (if enabled)
Reset pin
INT
Software Watchdog
CAN cell
Normal Request
Low for "reset-dur" time then high - Normally high. - Active low if W/D or Vdd1 under voltage occurs (and mode 1 selected) same as Normal Mode - CAN - SPI - L0,L1,L2,L3 - Cyclic sense - Forced Wake up - Idd1 Over current* (*always enable) - CAN - SPI - L0,L1,L2,L3 - Cyclic sense - Forced Wake up If enabled, signal failure (Vdd pre warning temp, CAN, HS1) same as Normal Mode
Normal
Running
Tx/Rx
Standby
Running
Low power
Stop
- Normally high. - Active low if W/D (*) or Vdd1 under voltage occurs (*): if enabled
Signal SBC wake up and Idd>Idd1s-wu (not maskable)
- Running if enabled - Not Running if disabled
- Low Power - Wake up capability if enabled - Low Power - Wake up capability if enabled same as Normal same as Standby Same as Stop not operating
Sleep
Low
Not active
No Running
Debug Normal Debug Standby Stop Debug Flash program ming
- Normally high. - Active low if Vdd1 under voltage occur - Normally high. - Active low if Vdd1 under voltage occur Same as Stop - Normally high. - Active low if Vdd1 under voltage occur not operating
Same as Normal Same as Standby
Not running
Not running
Same as Stop
Same as Stop
Not running
Forced externally
not operating
not operating
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STATE MACHINE
State machine (not valid in debug modes)
W/D: timeout OR Vdd1 low W/D: timeout & Nostop & !BATFAIL Reset counter (3.4ms) expired 2 SPI: standby & W/D trigger (note1) 3
1
Reset
W /D :t im
Normal Request
1 Vdd1 low OR W/D: time out 350ms & !Nostop
eo ut O
Standby
Nostop & SPI: sleep & CSB low to high transition Nostop & SPI: sleep & CSB low to high transition
S to PI: hi St gh o t ra p & ns C itio SB n lo
SBC power up
w
4
SPI: standby 1
Wake up
R
Vd d
1
lo
w
(n o
Power Down
te
2)
2 1
Stop
W/D: timeout OR Vdd1 low
SPI: Stop & CSB low to high transition
Normal
Wake up (Vdd1 high temperature OR (Vdd1 low > 100ms & Vsup >BFew)) & Nostop & !BATFAIL
SPI: normal
/D W rig :T r ge
Sleep
1 2 3 4 denotes priority State machine description: "Nostop" means Nostop bit = 1 "! Nostop" means Nostop bit = 0 "BATFAIL" means Batfail bit = 1 "! BATFAIL" means Batfail bit = 0 "Vdd1 over temperature" means Vdd1 thermal shutdown occurs "Vdd1 low" means Vdd1 below reset threshold "Vdd1 low > 100ms" means Vdd1 below reset threshold for more than 100ms "W/D: Trigger" means TIM1 register write operation. Vsup>BFew means Vsup > Battery Fall Early Warning (6.1V typical)
"W/D: time out" means TIM1 register not written before W/D time out period expired, or W/D written in incorrect time window if window W/D selected (except stop mode). In normal request mode time out is 355ms p2.2 (350ms p3)ms. "SPI: Sleep" means SPI write command to MCR register, data sleep "SPI: Stop" means SPI write command to MCR register, data stop "SPI: Normal" means SPI write command to MCR register, data normal "SPI: Standby" means SPI write command to MCR register, data standby Note 1: these 2 SPI commands must be send in this sequence and consecutively. Note 2: if W/D activated
Behavior at SBC power up
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Transitions to enter debug modes
W/D: time out 350ms
Normal Request
W/D: Trigger
Reset counter (3.4ms) expired
Reset
Power Down
Normal
SPI: MCR (0000) & Normal Debug
Normal Debug
SPI: MCR (0000) & Standby Debug
Standby Debug
Simplified State machine in debug modes
W/D: time out 350ms
Stop (1)
Wake up
Normal Request
SPI: standby & W/D: Trigger R
Reset counter (3.4ms) expired
Reset
R
er
Wake up
Sleep
& !BATFAILNOSTOP & SPI: Sleep
R
up
W/
D:
Trig g
W ak
e
R
R
R
SPI: Stop
SPI: Stop debug &CSB low to high transition
SPI: standby debug
E
E
SPI: Standby debug
Standby Debug
SPI: Normal debug
Normal Debug
R
R
(1) If stop mode entered, it is entered without watchdog, no matter the WDSTOP bit. (E) debug mode entry point (step 5 of the debug mode entering sequence). (R) represents transitions to reset mode due to Vdd1 low.
SPI: Normal Debug
SP I: St an
de bu g
db
y
I: n or
ma l
D eb
ug
Stop debug
Standby
SP
Normal
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7.1
SPI INTERFACE AND REGISTER DESCRIPTION
Data format description Bit7 MISO A2 Bit6 A1 Bit5 A0 Bit4 R/W Bit3 D3 Bit2 D2 Bit1 D1 Bit0 D0 MOSI Read operation: R/W bit = 0 Write operation: R/W bit = 1
address
data
The SPI is a 8 bit SPI. First 3 bits are used to identify the internal SBC register adress, bit 4 is a read/write bit. The last 4 bits are data send from MCU to SBC or read back from SBC to MCU. During write operation state of MISO has no signification. During read operation only the last 4 bits at MISO have a meaning (content of the accessed register) Following tables describe the SPI register list, and register bit meaning. Registers "reset value" is also described, as well as the "reset condition". Reset condition is the condition which cause the bit to be set at the "reset value". Possible reset condition are: Power On Reset: POR SBC reset: SBC mode transition: NR2R - Normal Request to Reset mode NR2N - Normal Request to Normal mode NR2STB - Normal Request to Standby mode N2R - Normal to Reset mode STB2R - Standby to Reset mode STO2R - Stop to Reset mode STO2NR - Stop to NormalRequest RESET - SBC in Reset mode
SBC mode: List of Registers: Name MCR RCR Adress $000 $001
Description Mode control register Reset control register
Comment and usage Write: Control of normal, standby, sleep, stop, debug modes Read: BATFAIL flag and other status bits and flags Write: Configuration for reset voltage level, safe bit, stop mode Read: CAN wake up and CAN failure status bits Write: CAN module control: Tx/Rx & sleep modes, slope control, wake enable/disable. Read: CAN wake up and CAN failure status bits Write: HS1 (high side switch) control in normal and standby mode Read: HS1 over temp bit, Vsup and V2 low status. Write: Control of wake up input polarity Read: Wake up input, and real time Lx input state Write: TIM1, Watchdog timing control, window or Timeout mode. Write: TIM2, Cyclic sense and force wake up timing selection Write: Control of HS1 periodic activation in sleep and stop modes, force wake up. Write: Interrupt source configuration Read: INT source
CAN
$010
CAN control register
IOR WUR TIM LPC INTR Table 7-1.
$011 $100 $101 $110 $111
I/O control register Wake up input register Timing register Low power mode control register Interrupt register
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7.1.1 MCR register MCR $000b Reset value Reset condition Control bits: MCTR2 0 0 0 0 0 1 1 1 1 MCTR1 0 0 1 1 1 0 0 1 1 MCTR0 0 1 0 1 1 0 1 0 1 SBC mode Enter/leave debug mode Normal Standby Stop, watchdog off (2) Stop, watchdog on (2) Sleep (3) Normal Standby Stop No watchdog running, debug mode Description To enter or leave debug mode, refer to detail description in chapter 4. W R BATFAIL (1) D3 D2 MCTR2 VDDTEMP 0 POR, RESET D1 MCTR1 GFAIL 0 POR, RESET D0 MCTR0 WDRST 0 POR, RESET
(1): Bit BATFAIL cannot be set by SPI. BATFAIL is set when Vsup falls below 3V. (2): Watchdog ON or OFF depends upon RCR register bit D3. (3): Before entering sleep mode, bit BATFAIL in MCR register must be previously cleared (MCR read operation), and bit NOSTOP in RCR register must be previously set to 1. Status bits: Status bit GFAIL BATFAIL VDDTEMP WDRST 7.1.2 RCR register RCR $001b Reset value Reset condition W R D3 WDSTOP 1 POR, RESET, STO2NR D2 NOSTOP 0 POR, NR2N, NR2STB D1 SAFE 0 POR D0 RSTTH 0 POR Description Logic OR of CAN failure (TXF permanent dominant or CAN over current or CAN therm) or HS1 over temp or V2 low Battery fail flag (set when Vsup < 3V) Temperature pre-warning on VDD (latched) Watchdog reset occurred
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Control bits: Condition Device power up V1 normal, WD is properly triggered V1 drops below Rstth WD time out SAFE 0 1 0 1 0 1 0 1 WDOGB pin 0 1 1 1 0 Reset pin 0 => 1 1 1 0 0 0 1
Status bit WDSTOP
Bit value 0 1 0 1 0 1
Description No watchdog in stop mode Watchdog runs in stop mode Device can not enter sleep mode Sleep mode is allowed, device can enter sleep mode Reset threshold 1 selected (typ 4.6V) Reset threshold 2 selected (typ 4.2V)
NOSTOP
RSTTH
7.1.3 CAN register Description: control of the high speed CAN module, mode, slew rate and wake up CAN $010b Reset value Reset condition W R CANWU D3 D2 SC1 TXF 0 POR D1 SC0 CUR 0 POR D0 MODE THERM 0 POR
7.1.3.1 High speed CAN transceiver modes Description: Mode bit (D0) controls the state of the CAN module, Normal or Sleep mode. SCO bit (D1) defines the slew rate when the CAN module is in normal, and controls the wake up option (wake up enable or disable) when the CAN module is in sleep mode. CAN module modes (Normal and Sleep) are independent of the SBC modes. SC1 0 0 1 1 X X SC0 0 1 0 1 1 0 MODE 0 0 0 0 1 1 CAN Mode CAN normal, slew rate 0 CAN normal, slew rate 1 CAN normal, slew rate 2 CAN normal, slew rate 3 CAN sleep and CAN wake up disable CAN sleep and CAN wake up enable
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Status bits: Status bit CANWU TXF CUR (1) THERM Description CAN wake-up occurred Permanent dominant TX CAN transceiver in current limitation CAN transceiver in thermal shut down
Errors bits are latched in the CAN registers. (1) Bit CUR is set to 1 when the CAN interface is programmed into "CAN NORMAL" for the first time after V2 turn ON. In order to clear the bit CUR following procedure must be used: after V2 is ON (SBC in Normal mode and V2 above V2 threshold) the CAN interface must be set into "CAN sleep", and then turn back into "CAN NORMAL". 7.1.4 IOR register Description.: control of HS1 in normal and standby modes IOR $011b Reset value Reset condition Control bits: HS1ON 0 1 HS1 state HS1 OFF, in normal and standby mode HS1 ON, in normal and standby mode W R V2LOW D3 D2 HS1ON HS1OT 0 POR VSUPLOW DEBUG D1 D0
When HS1 has been turned off because of over temperature, it can be turned on again by setting the appropriate control bit to "1". Errors bits are latched in the IOR registers.
Status bits: Status bit V2LOW HS1OT VSUPLOW DEBUG Description V2 below 4V High side 1 over temperature Vsup below 6.1V If set, SBC accepts command to go to Debug modes (no WD)
7.1.5 WUR register The local wake-up inputs L0, L1, L2, and L3 can be used in both normal and standby mode as port expander and for waking up the SBC in sleep or stop mode. WUR $100b W R D3 LCTR3 L3WU D2 LCTR2 L2WU D1 LCTR1 L1WU D0 LCTR0 L0WU
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WUR Reset value Reset condition D3 0 D2 0 D1 0 D0 0
POR, NR2R, N2R, STB2R, STO2R
The wake-up inputs can be configured almost separetly, where L0 and L1 are configured together and L2 and L3 are configured together. Control bits:. LCTR3 X X X X 0 0 1 1 Status bits: Status bit L3WU L2WU L1WU L0WU note: Status bits have two functions. After SBC wake up, they indicate the wake up source (exemple: L2WU set at 1 if wake up source is L2 input). After SBC wake and once the WUR has been read, status bits indicates the real time state of the Lx inputs (1 mean Lx is above threshold, 0 means that Lx input is below threshold). If after a wake up from Lx input, a W/D timeout occurs before the first reading of the WUR register, the LxWU bits are reset. This can occurs only if SBC was in stop mode. 7.1.6 TIM registers Description: This register is splitted into 2 sub registers, TIM1 and TIM2. TIM1 controls the watchdog timing selection as well as the window or time out option. TIM1 is selected when bit D3 is 0. TIM2 is used to define the timing for the cyclic sense and forced wake up function. TIM2 is selected when bit D3 is 1. No read operation is allowed for registers TIM1 and TIM2 Wake-up occurred (sleep/ stop mode), logic state on Lx (standby/ normal mode) Description LCTR2 X X X X 0 1 0 1 LCTR1 0 0 1 1 X X X X LCTR0 0 1 0 1 X X X X L0/L1 configuration inputs disabled high level sensitive low level sensitive both level sensitive inputs disabled high level sensitive low level sensitive both level sensitive L2/L3 configuration
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7.1.7 TIM1 register. TIM1 $101b Reset value Reset condition Description WDW 0 0 0 0 1 1 1 1 WDT1 0 0 1 1 0 0 1 1 WDT0 0 1 0 1 0 1 0 1 Timing [ms] 10 45 100 350 10 45 100 350 Parameter Watchdog period 1 Watchdog period 2 Watchdog period 3 Watchdog period 4 Watchdog period 1 Watchdog period 2 Watchdog period 3 Watchdog period 4 window watchdog enabled (window lenght is half the watchdog timing) no window watchdog W R 0 POR, RESET 0 POR, RESET 0 POR, RESET D3 0 D2 WDW D1 WDT1 D0 WDT0
Watchdog operation (window and time out) window closed no watchdog clear allowed window open for watchdog clear
WD timing * 50%
WD timing * 50%
Watchdog period (WD timing selected by TIM 1 bit WDW=1) Window watchdog window open for watchdog clear
Watchdog period (WD timing selected by TIM 1, bit WDW=0) Time out watchdog
7.1.8 TIM2 register The purpose of TIM2 register is to select an appropriate timing for sensing the wake-up circuitry or cyclically supplying devices by switching on or off HS1. TIM2 $101b W R D3 1 D2 CSP2 D1 CSP1 D0 CSP0
26
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MC33989
TIM2 Reset Value Reset condition D3 D2 0 POR, RESET D1 0 POR, RESET D0 0 POR, RESET
CSP2 0 0 0 0 1 1 1 1
CSP1 0 0 1 1 0 0 1 1
CSP0 0 1 0 1 0 1 0 1
Cyclic sense timing [ms] 5 10 20 40 75 100 200 400
Parameter
Cyclic sense/FWU timing 1 Cyclic sense/FWU timing 2 Cyclic sense/FWU timing 3 Cyclic sense/FWU timing 4 Cyclic sense/FWU timing 5 Cyclic sense/FWU timing 6 Cyclic sense/FWU timing 7 Cyclic sense/FWU timing 8
Cyclic sense on time
HS1 ON HS1 Cyclic sense timing, off time HS1 OFF sample 10 us
Lx sampling point
t 7.1.9 LPC register Description: This register controls: - The state of HS1 in stop and sleep mode (HS1 permanently off or HS1 cyclic) - Enable or disable the forced wake up function (SBC automatic wake up after time spend in sleep or stop mode, time defined by TIM2 register) - Enable or disable the sense of the wake up inputs (Lx) at sampling point of the cyclic sense period (LX2HS1 bit). LPC $110b Reset value Reset condition W R 0 POR, NR2R, N2R, STB2R, STO2R 0 POR, NR2R, N2R, STB2R, STO2R 0 POR, NR2R, N2R, STB2R, STO2R D3 LX2HS1 D2 FWU D1 D0 HS1AUTO
MC33989
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MC33989
LX2HS1 0 1
Wake-up inputs supplied by HS1 no yes, Lx inputs sensed at sampling point
HS1AUTO 0 1
Autotiming HS1 in sleep and stop modes off on, HS1 cyclic, period defined in TIM2 register
refer to chapter 4.9.2 for detail of the LPC register set up required for proper cyclic sense or direct wake up operation. 7.1.10 INTR register Description: This register allows to mask or enable the INT source. A read operation informs about the interrupt source. INTR $111b Reset value Reset condition Control bits: Control bit CANF VDDTEMP HS1OT-V2LOW VSUPLOW Description Mask bit for CAN failures Mask bit for VDD medium temperature (pre warning) Mask bit for HS1 over temperature AND V2 below 4V Mask bit for Vsup below 6.1V W R D3 VSUPLOW VSUPLOW 0 POR, RESET D2 HS1OT-V2LOW HS1OT 0 POR, RESET D1 VDDTEMP VDDTEMP 0 POR, RESET D0 CANF CANF 0 POR, RESET
When the mask bit has been set, INTB pin goes low if the appropriate condition occurs. Status bits: Status bit CANF VDDTEMP HS1OT VSUPLOW Notes: Description CAN failure VDD medium temperature (pre warning) HS1 over temperature Vsup below 6.1V
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If HS1OT-V2LOW interrupt is only selected (only bit D2 set in INTR register), reading INTR register bit D2 leads to two possibilities: Bit D2 = 1: INT source is HS1OT. Bit D2 = 0: INT source is V2LOW. HS1OT and V2LOW bits status are available in IOR register. Upon a wake up condition from stop mode due to over current detection (Idd1s-wu1 or Idd1s-wu2), an INT pulse is generated, however INTR register content remains at 0000 (not bit set into the INTR register). The status bit of the INT register content are a copy of the IOR and CAN registers status content. To clear the INT register bit the IOR and/or CAN register must be cleared (read register). Once this operation is done at IOR and CAN register the INT register is updated. Errors bits are latched in the CAN and IOR registers.
MC33989
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MC33989
8
TYPICAL APPLICATION SCHEMATIC:
MC33989, SBC High Speed Typical Application Schematic Vbat R6 D1 Rp R1 SW1 to L0 C6 HS1
L0
Q1 V2
Vsup C1 C2
Vsup monitor Dual Voltage Regulator Vdd1 Monitor
V2CTRL
5V/200mA
C10 Vdd1 C4
C5
V2 C3 INTB WDOGB
HS1 control
Mode control Oscillator Int Watchdog Reset V2
Rp R2 SW2 to L1 C7
L1 L2 L3
Programmable wake-up input
Reset
MOSI SCLK MISO CSB V2 Tx Rx Gnd MCU
SPI Interface
CAN H CAN L SW3 R3 Rd C8 to L2 Internal Module Supply Clamp(1) R4 C9 to L3
1Mbit/s CAN Physical Interface
Safe Circuitry
SW4
Rd Connector
Detail of CAN standard termination schematic (not splitted termination) CAN H (SBC) CAN H L1 CAN L CAN Connector CL CH R5 120 ohms CAN L (SBC)
Component values: D1: Q1: MJD32C R1,R2,R3,R4: 10k R5: 120 Rp, Rd: R6: 2.2k C1: 10uF C2: 100nF C3: 47uF C4: 100nF
C5: 47uF tantal C6,C7,C8,C9,C10: 100nF CL, CH: 220 pF
Detail of CAN splitted termination schematic
CAN H L1 CAN L CAN Connector CL CH
CAN H (SBC) R6, 60 ohms R7, 60 ohms CAN L (SBC) CS
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CASE OUTLINE
A
D
28 15
M
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 4. MAXIMUM MOLD PROTRUSION 0.015 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION.
E
H
1 14 PIN 1 IDENT
B
0.25
M
B
e B 0.025
M
A1
0.10
SEATING PLANE
L C
C CA
S
MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.13 0.29 B 0.35 0.49 C 0.23 0.32 D 17.80 18.05 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 L 0.41 0.90 q 0x 8x
B
S
A
CASE 751F-05 ISSUE F
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31
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other appl ication in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners. (c) Motorola, Inc. 2002
HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution: P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1 Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tao Po, N.T., Hong Kong. 852-26668334 TECHNICAL INFORMATION CENTER: 1-800-521-6274
MC33898/D


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